Thermal Endurance
20,000 hr Life >200°C
Thermoplastic Flow
min : 300°C
typical : 350°C
Heat Shock (20% 3x)
½ hr @ 220°C min : no cracks
½ hr @ 240°C min : no cracks
Solderability
Not designed to be self-solderable
Stress Relief Temp: 160°C
MECHANICAL

Mandrel Flexibility
After Elongation
min : 20% 3x OK
typical : 30% 1x OK
After Snap
min : 3x OK
typical : 1x OK
Unilateral Scrape
Avg of 3 tests (taken at 120° increments)
min : 1150 gms
typical : 1700 gms
Dynamic C of F typical: 0.06
ELECTRICAL

Pulse Endurance Test
20,000 Hz, 2000 V, 0.025 microsecond rise time
150°C, 50% Duty Cycle - Twisted Pairs
18 HTAIH Reference = 600 seconds
18 HTAIHSD Reference = 80,000 seconds
Pulse Endurance Index (PEI) > 100
Life of Product/Life of Same Size and Build MW-35 (Reference)
Dielectric Breakdown
NEMA min: 5.7 kV typical: 11 kV
Corona Inception Voltage
typical: 580V
High Voltage Continuity
NEMA @ 1500 V DC : 5 faults/100 feet max
Typical @ 3000 V DC : 0-1 faults/100 feet
CHEMICAL

Retained Dielectric
After 72 hrs exposure to R-22 +150°C conditioning:
NEMA min: 5.7 kV
typical: 10.7 kV
R-22 Extractables: 0.8%
Resistance to Solvents
| after 24 hrs @ RT : |
Pass
Solvents Including:
Xylene,
50/50 Cellosolve/Xylene,
Perchloroethylene,
1% NaOH,
28% Sulfuric Acid,
Gasohol |
Procedure followed to determine published values:
NEMA: National Electrical Manufacturers Association
JIS: Japanese Industrial Standards
IEC: International Electrotechnical Commission
ASTM: American Society for Testing and Materials